Smart Card Inlay (Prelam)
Product Information
Smart cards are typically composed of various materials, including chips, antennas, substrates, and encapsulation materials. At the heart of the card lies the chip, responsible for data storage and executing functions. Antennas enable wireless communication with card readers. Substrates provide structural support and connect the chip and antenna. Encapsulation materials protect the chip and antenna, enhancing the smart card’s appearance and durability.
Intellhydro offers both Contactless RFID Prelamination Sheets and Dual-Interface Smart Card Prelamination Sheets.
Dual-interface Smart Card Prelamination Sheets
| Item | Pick line | Coupling | Zig-Zag |
|---|---|---|---|
| Size | 460*310mm/476*380mm/486*410mm/customized | ||
| Layout | 2×5/ 3×6 / 3×8 / 4×4 / 4×8 / 4×10 / 5×5 / 6×8 / customized | ||
| Thickness | 0.15/0.21/0.42 ±0.02mm or customized | ||
| Material | PVC/ ABS/ PETG | ||
| Chip | As your request | ||
| Frequency | As your request | ||
Contact-less RFID Card Prelamination Sheets
| Item | HF | UHF | LF |
|---|---|---|---|
| Size | 460*310mm/476*380mm/486*410mm/customized | ||
| Layout | 2×5/ 3×6 / 3×8 / 4×4 / 4×8 / 4×10 / 5×5 / 6×8/ 5×10 or customized | ||
| Thickness with IC | 0.4-0.5 ±0.06mm or customized | 0.5/0.55 ±0.06mm or customized | |
| Thickness without IC | 0.4-0.5 ±0.04mm or customized | 0.5/0.55 ±0.04mm or customized | |
| Chip type | NXP, Infineon, EM, TI | FM or customized chips Alien, Impinj, Avery Dension or customized chips | NXP, EM, TK, Atmel or customized chips |
| Material | PVC/ ABS/ PETG | ||
| Frequency | 13.56±0.5Mhz or customized | 860-960Mhz | -125±6Khz |
Production
Equipment
- Ultrasonic wire embedding
- Full auto-antenna implanting
- Auto-welding
- Full auto-chip assembly
Capacity & Layout
- 9 full automatic production lines
- Monthly production capacity: 20,000,000 pieces
- Various layout configurations available: 2×5, 3×6, 3×8, 4×4, 4×8, 4×10, 5×5, 6×8, 8×10, etc.